Shenzhen Ruidian Electric Co. , Ltd

Shenzhen Ruidian Electric Co. , Ltd

Manufacturer from China
Active Member
6 Years
Home / Products / SMT Machine Parts /

Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

Contact Now
Shenzhen Ruidian Electric Co. , Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Now

Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

Ask Latest Price
Video Channel
Model Number :SMT spare parts Tin Lead Free Solder Welding Dim Bar
Place of Origin :shenzhen
MOQ :1
Price :negotiation
Payment Terms :T/T
Supply Ability :1000pcs/days
Delivery Time :8days
Packaging Details :carton
part no :Bar Sn/AG/Cu Sn/Cu Sn/AG
brand :china
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

SMT spare parts Tin Lead Free Solder Welding Dim Bar Sn/AG/Cu Sn/Cu Sn/AG

Our company provides Tin Lead Free Solder Bar with a variety of alloy composition , content and size of the diameter of pharmaceutical different specifications tin for customer choice:

Alloy composition (wt.%) Diameter Flux Content Weight / Roll Melting pointºC Working point Usage & Application
Type Tin-Sn Silver-Ag Copper-Cu
SAC305 96.50% 3.00% 0.50% 0.8-3.0mm 1.8-2.4% 750-1000g 217-219 280-320 LED, IT, PCB, High-class electronics, Lighting industry, Radiators, Household appliance and Precise Instruments, Audio and Sound System and other soldering
SAC300 97.00% 3.00% 0% 217-220 280-320
SAC0307 99.00% 0.30% 0.70% 217-225 260-320
SAC07 99.30% 0.00% 0.70% 227 260-280
  • Anti-oxidation tin lead free bar
  • High temperature tin lead free bar
  • Low temperature tin lead free bar
  • Dim tin lead free bar
  • Silver tin lead free bar
  • Tin lead free solder bar for other particular applications
  • 3.15cm * 1.5cm * 1.0cm

    500g/PC

    • Eutectic alloy.
    • Bridge-free and icicle-free soldering.
    • Smooth, bright, well-formed fillets, free of gross micro-cracks, irrespective of the cooling rate.
    • Good through-hole penetration.
    • Good topside fillet formation.
    • Dross rate equal or lower than tin-lead solder.
    • Does not require a nitrogen atmosphere.
    • Does not erode copper from holes, pads and tracks.
    • Low rate of copper leaching makes it easy to control the copper content of the solder bath.
    • Lower aggressiveness to stainless steel and other solder pot materials as compared to tin-silver-copper alloys.
    • Thermal fatigue resistance and creep strength better than tin-lead.
    • Slow, even growth of the intermetallic layer at the solder/substrate interface.
    • Also performs well in selective and dip soldering.

Thermal Fatigue Resistant SMT Machine Parts / Tin Lead Free Solder Bar

Inquiry Cart 0